Chip manufacturers deploy advanced macro defect inspection throughout the fab to monitor key process steps, gather process-enhancing information and ultimately, lower manufacturing costs. Field-established tools such as the NSX® and AXi™ systems are found in wafer processing and final manufacturing, providing inspection down to 0.5 micron resolution. In addition to frontside inspection, Rudolph's innovative Explorer™ Cluster provides all-surface inspection in one integrated platform to enhance productivity and continuously improve fab yield.

The IBU Probe Card Test & Analysis Division designs and manufactures probe card metrology systems, wafer inspection systems and probe card interface devices to help improve process yields. Most probe card manufacturers test and qualify probe cards during their design and manufacture, and semiconductor manufacturers must test and verify the operation of those probe cards during their lifetime in the fab.