Film metrology enables process engineers to monitor and correct quality problems by evaluating composition, thickness and other film properties throughout the chip manufacturing process. This has led to the development of production-worthy, fully-automated systems for thin film process control. To measure transparent films, Rudolph offers laser ellipsometers with the patented Focused Beam™ Ellipsometry (FBE) technology. This provides for the most reliable, unambiguous results on films ranging from the very thinnest to the thickest used in semiconductor production. Opaque films on wafers are measured with the patented Picosecond Ultrasonic Laser Sonar (PULSE™) technology, simultaneously measuring thickness and other properties of five or more metal film layers in a non-contact manner.