For both standard and flip chip wafers for 200 mm and 300 mm in diameter, the WS 3800 Wafer Inspection System provides superior yield management for defect inspection throughout post-fab processes. Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact production yields and time-to-market. The WS 3800 quickly and reliably locates wafer defects and classifies them -- reducing process costs and improving yield. No wonder the WS 3800 is the industry standard for advanced packaging applications.