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MetaPULSE System

The MetaPULSE® System uses patented picosecond ultrasonic laser sonar (PULSE™) technology to provide the industry's first production-worthy opaque film metrology tool. Its small-spot, non-contact, non-destructive technology enables on-product thickness measurements of single or multi-layer opaque films for aluminum and copper processes. In addition to thickness, the MetaPULSE identifies missing layers or interfacial problems such as poor adhesion, and characterizes material properties such as density and roughness. MetaPULSE is used by all of the top ten semiconductor manufacturers, and nearly 200 tools are currently providing production monitoring in fabs around the world.

Overview

Offers high-throughput thickness measurements of opaque films or film stacks ranging in thickness from 40 Angstroms to 5 microns with Angstrom accuracy and sub-Angstrom repeatability
Accurate, independent measurements of the thickness of each individual layer in a film stack are made with virtual immunity to interference from underlying structures by the time-separated results of the laser sonar technique
On-product measurements are enabled with the small laser spot size and non-contact, non-destructive measurement method
In addition to thickness, PULSE Technology can determine RMS roughness, material density, adhesion, material phase, low-k inter-level dielectric modulus, and interlayer reactions
Fast, accurate measurements of product wafers are achieved with field-proven wafer handling and robust pattern recognition
Meets industry standards for 200mm and 300mm automation
EASy Software incorporates years of expert application knowledge to provide users with robust recipes to measure structures containing different materials, single layer films ranging in thickness from Angstroms to microns, and films such as silicides

Opaque Film Metrology

MetaPULSE-II System

Opaque Film Metrology

MetaPULSE-III System

Opaque Film Metrology