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ultra-II System

The latest generation of Rudolph's Focused Beam™ laser ellipsometry technology, the ultra-II™ is designed to deliver the superior measurement accuracy, repeatability, and tool-to-tool matching required for process control measurements in semiconductor manufacturing for the 90 nm, 65 nm, and 45 nm technology nodes and for 193 nm lithography. The MAControl™ option provides a unique solution for eliminating the effects of molecular airborne contaminants on ultrathin oxide films, providing unparalleled measurement repeatability and long-term reproducibility. DUV reflectometer improvements provide industry-leading performance on many advanced applications including nitrided gates, 193 nm ARCs, and low-k integration silicon nitride and silicon carbide films.

Overview

  • Accurate and detailed ultrathin oxide uniformity maps are created with MAControl, which removes adsorbed molecular airborne contaminants with a single, fast, full-wafer cleaning step and a controlled environment that inhibits regrowth
  • Offers 0.03 Å long-term reproducibility or better on sub-20 Å gate oxides
  • Measures both the thickness and nitrogen concentration of ultrathin nitrided gates and is ready for next-generation high-k gates
  • Characterizes ARC materials for 193 nm lithography and when measuring the thickness and stoichiometry of the silicon nitride and silicon carbide films used for interconnect etch stops, copper diffusion barriers, hard mask, and CMP polish stops
  • Gauge capable thickness measurements of films ranging from 20 Å to greater than 20,000 Å are achieved with patented multi-angle capability, which simultaneously performs ellipsometry from a 40º to a 70º angle of incidence, which can end order ambiguity
  • Unparalleled system-to-system matching, superior repeatability, and significantly lower maintenance are attainable by using up to three laser light sources that cover the spectrum with inherently stable wavelengths and long lifetimes
  • Low cost of ownership is realized with modular measurement capabilities that can easily be added to the platform as interchangeable modules, delivering superior performance in CMP, CVD, etch, lithography, and diffusion applications
  • Fast image processing and greater immunity to noise, low contrast, and color variation than other commonly used systems are made possible with Zheng™ pattern recognition
  • Meets industry standards for 300 mm automation (not available in 200mm configurations)
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