The ultra-WB integrates advanced wafer-bow/stress measurement technology on the fab-proven Vanguard automation platform, providing manufacturers automated and accurate results for 300 mm wafers
Flanders, N.J., October 16, 2003 - Rudolph Technologies, Inc. (Nasdaq:RTEC) today formally introduced the ultra-WB™, a wafer-bow/stress metrology tool for high-volume manufacturing applications. The ultra-WB is the industry's first tool to combine sophisticated wafer-bow/stress metrology technology on a fab-proven automation platform, filling manufacturers' critical need for a system that provides superior measurement performance in a reliable, high-throughput tool designed for fab integration.
The ultra-WB tool is designed to measure the stress that develops when thin films are deposited on semiconductor wafers during production. Given that stress increases with wafer size, the prevention of stress-related problems such as cracking or delamination can result in significant yield improvement for manufacturers of 300 mm wafers.
"Controlling the amount of wafer-bow/stress that develops in thin films is critical to high yield, particularly for manufacturers transitioning to 300 mm wafers. The ultra-WB's patented technique provides superior measurement results to help realize this goal," said George Collins, PhD, Vice President of Marketing.
"It is important to recognize that the challenges of process control measurements at 300 mm include more than the ability to provide very accurate and repeatable measurements with excellent tool-to-tool matching. The tools must also meet the industry's requirements for 'lights-out' 300 mm fab automation," added Collins. "Because the ultra-WB is built on the VANGUARD™ automation platform that has been successfully installed by more than 25 different 300 mm semiconductor manufacturers around the world, it meets these requirements."
High-levels of film stress can develop on thin films that are deposited in the high-temperature processes employed during semiconductor manufacturing. If the thermal expansion of the film and its substrate are different, stress develops as the deposited film cools to ambient temperature. Excessive stress can cause a variety of yield-robbing problems including voids, film cracking, film delamination, and performance degradation. Since the amount of stress is proportional to the wafer diameter, process control monitoring of wafer-bow/stress is a key requirement for 300 mm manufacturers.
Film stress causes the wafer to curve or bow slightly. The ultra-WB measures the radius of this curvature on unpatterned wafers with a sophisticated laser-based technology. The laser beam is broken into an array of multiple parallel beams and the relative spacing of the reflected beams is measured. This system is significantly less sensitive to vibration and other sources of error than competing techniques that rely on simple beam deflection and height measurements. It therefore provides greater sensitivity, resolution, and repeatability. The technology has been tested in multiple installations and has demonstrated the accuracy, long-term reproducibility, and tool-to-tool matching required for process control at leading manufacturers.
The ultra-WB is incorporated on Rudolph's VANGUARD automation platform, which serves as a base for the highly successful MetaPULSE® metal-film metrology systems and for the S, S-ultra™, and ultra-II™ transparent metrology film systems. Hundreds of VANGUARD platforms have been installed and are used in high-volume fabs around the world providing reliable, high-throughput operation. The system can be optionally equipped with FOUP loaders and SEMI-compliant 300-mm automation software, for integration with fab automation systems. The ultra-WB wafer-bow/stress technology is also available on the 200 mm VANGUARD platform and can be optionally equipped with SMIF pods and GEM-compliant SECS-II communications.
All of Rudolph's tools are backed by the company's worldwide customer support team, making ultra-WB a production-ready system for wafer-bow/stress process control.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology systems used by semiconductor device manufacturers. The Company provides a full-fab solution through its families of proprietary systems for metrology applications used throughout the device manufacturing process. Rudolph's product development has successfully anticipated and addressed many emerging trends that are driving the semiconductor industry's growth. The Company's success in creating complementary metrology applications through aggressive research and development is key to Rudolph's strategy for continued technological and market leadership.
Safe Harbor Statement
This press release contains forward-looking statements. Actual results may differ materially from those projected due to a number of risks, including, but not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph Technologies' business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph Technologies cannot guarantee future results, levels of activity, performance or achievements. The matters discussed in this press release also involve risks and uncertainties summarized under the heading "Risk Factors" in Rudolph Technologies' Form 10K filed for the year ended December 31, 2002. These factors are updated from time to time through the filing of reports and registration statements with the Securities and Exchange Commission. Rudolph Technologies does not assume any obligation to update the forward-looking information contained in this press release.