Expert Application System (EASy) Software Provides Simple Solutions for Critical Process Control Measurements at Advanced Technology Nodes
Flanders, N.J., November 12, 2003 - Rudolph Technologies, Inc. (Nasdaq: RTEC) today announced enhanced capabilities of its MetaPULSE® and MetaPULSE-II™ opaque film metrology line through the use of its Expert Application System (EASy™) software. EASy enables a second-generation of robust and easy-to-use metrology solutions for a variety of copper, low-κ, and other process control challenges that face chip manufacturers as they ramp up to high-volume manufacturing at the 90 nm technology node and beyond. The software automates the measurement procedures that have been identified and fab-tested to help solve yield-robbing manufacturing problems.
"Rudolph's new EASy software is proving to be a critical enabler for high-yield manufacturing at advanced technology nodes," said Dr. George Collins, vice president of marketing. "With over 25 MetaPULSE and MetaPULSE-II tools already providing production process control of opaque films and film stacks at the 90 nm node, we understand the challenges facing manufacturers in the fab and have developed robust solutions. High-volume production requires process control metrology that is non-destructive, fast, accurate, repeatable, and user-friendly. With EASy, even novice fab technicians can quickly obtain production-worthy measurement results for advanced opaque thin-film applications that previously required an expert operator or multi-step manual analysis."
EASy recipes have been fab-tested on a variety of critical copper applications including: electroplate edge profiling, residual copper/barrier detection after chemical mechanical planarization (CMP), and copper/interlevel dielectric (ILD) dishing. Before EASy, these measurements required expert analysis of the PULSE signal to determine the appropriate signal processing for each measurement site. EASy uses knowledge-based software to produce optimal results quickly and automatically. The ability to rapidly generate edge profiles allows manufacturers to detect exclusion-width and film-centering excursions in production. These excursions can significantly reduce the yield of chips on the wafer's edge. The edge-profiles can also be used to control the deposition to help prevent CMP related problems.
For post-CMP measurements, EASy checks for traces of copper or barrier on the ILD spacers between lines and automatically reports if the lines are clear, if there is residual barrier, or the thickness of any residual copper. This is a yield-critical measurement as residual barrier or copper can result in the copper lines shorting together, which results in defective die. EASy also generates copper/ILD dishing profiles by automatically determining if the measurement site consists of copper or ILD and applying the right model for each material. Manufacturers must control dishing so the copper lines maintain the desired performance and also to prevent problems caused by non-planarity of the wafer in overlying metal levels.
Other applications take advantage of the ability of EASy to perform complex signal processing in-line. Manufacturers who are beginning to integrate low-κ materials in their process can use EASy to measure Young's modulus that determines the ability of the material to withstand the mechanical stresses of CMP or packaging. Before EASy, this measurement required off-line modeling, but now modulus can be reported automatically, providing timely feedback information to the deposition tools and feedforward information to CMP or packaging. Similarly, advanced signal processing enables manufacturers to determine the thickness and phase of the cobalt silicide used for making contact with the device's transistors at the 90 nm node and below. Reaching the desired phase is critical for low resistivity contacts and high-yield.
"Rudolph has developed the new capabilities based on extensive experience gained by working with virtually every major manufacturer who has announced development of a 90 nm process," added Collins. "EASy software is an example of the investment Rudolph has made for its customers working at the 90 nm node."
EASy software is available on Rudolph Technologies' 200 mm and 300 mm MetaPULSE-II systems and as an upgrade for existing and new MetaPULSE systems.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology systems used by semiconductor device manufacturers. The Company provides a full-fab solution through its families of proprietary systems for metrology applications used throughout the device manufacturing process. Rudolph's product development has successfully anticipated and addressed many emerging trends that are driving the semiconductor industry's growth. The Company's success in creating complementary metrology applications through aggressive research and development is key to Rudolph's strategy for continued technological and market leadership.
Safe Harbor Statement
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