Dual-inspection capability detects defects down to 0.5 microns with the highest throughput available in the industry
Flanders, N.J., June 21, 2004 ― Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit (IC) manufacturing, extends its leadership in automated macrodefect inspection by introducing the new WaferView® 325 system. The WaferView 325 provides high-throughput automated detection and classification of macro and sub-micron yield robbing defects on the front, back, and edge of 300 mm wafers; it also has an on-board, integrated ReviewScope™ microscope that enables rapid defect review. These features allow a single WaferView 325 to replace multiple inspection and review systems for the lowest cost of ownership. It is the newest member of the recently announced WaferView Team™, which also includes the i-MOD™, WaferView 320, and YieldView® products. Rudolph's Team is the first to offer cost-effective, real-time inspection of 100% of the surface of every wafer at process throughputs for each critical lithography, CMP, and etch process step.
"The 325 is a significant addition to our WaferView Team. It helps our customers improve yield by identifying more rework opportunities in lithography and CMP and by more quickly identifying etch excursions," said Christopher Morath, director of marketing, Rudolph Technologies. "The 325 offers our customers the versatility to develop the ideal inspection strategy for their specific processes by offering simultaneous high-throughput inspection for 20 micron and 5 micron defects ― it's truly an 'all in one' tool. We are excited about this product because it can bring both superior throughput and flexibility advantages to our customers at a low overall cost."
The WaferView 325's unique configuration incorporates two inspection heads that operate simultaneously and independently, one at 5-micron sensitivity, the other at 20 microns. Unlike typical competing macrodefect tools that reduce throughput up to sixteen times when detecting at 5 micron sensitivity, Rudolph can inspect 100% of the front surface of a 300 mm wafer for defects 5 microns or larger at greater than 50 wafers-per-hour (WPH). When combined with the 20-micron inspection head, the WaferView 325 can achieve throughputs greater than 150 WPH on product wafers, allowing manufacturers to cost-effectively inspect significantly more wafers for yield-robbing defects. In addition, like the WaferView 320 system, the 325 includes an on-board high-resolution ReviewScope for automated sub-micron inspection. The ReviewScope also provides rapid review, dispositioning, and root-cause analysis by eliminating the need to take wafers offline to a separate review station.
The WaferView 325 uses Rudolph's patented Automatic Defect Classification (ADC) technology, which has been developed over the past decade and established in fabs worldwide. Robust new detection and classification algorithms automatically adapt to normal wafer-to-wafer and lot-to-lot process variations. Additional features include user-friendly operation, fast automatic recipe creation, and the InstaMatch™ method for superior tool-to-tool matching of integrated and standalone systems within a fab or from fab-to-fab.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology and defect inspection systems used by semiconductor device manufacturers. The Company's products provide a full-fab solution through its families of proprietary systems, which are used throughout the device manufacturing process. Rudolph's product development has successfully anticipated and addressed many emerging trends that are driving the semiconductor industry's growth in order to enhance the competitiveness of its products in the marketplace. The Company's success in creating complementary metrology and inspection applications through aggressive research and development is key to Rudolph's strategy for continued technological and market leadership.
Safe Harbor Statement
This press release contains forward-looking statements. Actual results may differ materially from those projected due to a number of risks, including, but not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph Technologies' business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph Technologies cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties summarized under the heading "Factors that May Affect Future Results" in Rudolph Technologies' Form 10-K filed for the year ended December 31, 2003. These factors are updated from time to time through the filing of reports and registration statements with the Securities and Exchange Commission. Rudolph Technologies does not assume any obligation to update the forward-looking information contained in this press release.