New module can be integrated into CMP tools to provide high-throughput automated inspection for defects 5 microns and larger
San Francisco, Calif., July 12, 2004 ― Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit (IC) manufacturing, announced today a new member of the i-MOD™ family, specifically designed for integrated macrodefect inspection of chemical mechanical planarization (CMP) processes.
The integrated module enables, for the first time, inspection of the entire front surface of a 300 mm wafer for defects that are 5 μm (microns) or larger at CMP process equipment throughput. This capability is critical to manufacturers transitioning to copper and low-κ dielectric materials at the 90 nm technology node and below, where fab productivity may suffer as the result of an increase in the number and type of yield-robbing CMP defects. When integrated directly into the CMP tool, the module provides virtually instantaneous detection and classification of defects, enabling fast and efficient rework decisions, process excursion resolution, and faster process ramp or tool requalification for higher overall yield. The module is part of the WaferView® Team™ that offers 100-percent real-time automated inspection of every wafer at each critical process step.
"This new addition to the i-MOD™ family will help our customers overcome the many challenges facing CMP at advanced technology nodes", said Christopher Morath, director of marketing, Rudolph Technologies. "To capture the maximum number of yield-robbing defects, the module inspects every wafer for defects as small as 5 μm inside the process tool, eliminating the need for sampling strategies and identifying potential rework opportunities to improve yield. Because the wafers are inspected immediately after processing there are no extended 300 mm transportation delays to the inspection tools, so no additional wafers are at risk if an excursion should occur. Furthermore, the immediate feedback simplifies root-cause analysis and expedites process-problem resolution. This reduces tool downtime during high-volume manufacturing and is also critical when ramping up advanced processes. Providing yield engineers the information they need to tune the process quickly can generate significant cost-savings."
The high resolution integrated module represents one component of the WaferView Team that provides a full-fab solution for 5 μm defect inspection. The Team also includes the standalone inspection/review system, the WaferView 325, which incorporates the same optical design and vision system as the i-MOD, and the YieldView® defect database/recipe server. As part of the WaferView Team, the i-MOD features Rudolph's fab-proven patented Advanced Defect Classification (ADC) technology, user-friendly operation, and InstaMatch™ for fast and easy tool matching.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology and defect inspection systems used by semiconductor device manufacturers. The Company's products provide a full-fab solution through its families of proprietary systems, which are used throughout the device manufacturing process. Rudolph's product development has successfully anticipated and addressed many emerging trends that are driving the semiconductor industry's growth in order to enhance the competitiveness of its products in the marketplace. The Company's success in creating complementary metrology and inspection applications through aggressive research and development is key to Rudolph's strategy for continued technological and market leadership.
Safe Harbor Statement
This press release contains forward-looking statements. Actual results may differ materially from those projected due to a number of risks, including, but not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph Technologies' business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph Technologies cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties summarized under the heading "Factors that May Affect Future Results" in Rudolph Technologies' Form 10-K filed for the year ended December 31, 2003. These factors are updated from time to time through the filing of reports and registration statements with the Securities and Exchange Commission. Rudolph Technologies does not assume any obligation to update the forward-looking information contained in this press release.