Flanders, N.J., September 8, 2004 ― Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit (IC) manufacturing, announced today that it has received a multi-million dollar order from a leading US device manufacturer for multiple WaferView 320™ systems. The manufacturer already has an installed base of Rudolph's PULSE Technology™ tools that provide process control measurements for advanced copper processes. The new WaferView® tools will automatically detect and classify defects as small as 20 microns at throughputs greater than 100 wafers-per-hour (WPH). This is expected to improve overall yield and maximize return-on-investment by identifying more rework opportunities, allowing additional wafers with yield-robbing defects to be recovered.
"This selection is a validation of Rudolph's leading-edge product design and the capabilities of the WaferView 320," said Joe Martin, General Manager of Rudolph Technologies Yield Metrology Group, located in Richardson, Texas. "Manufacturers switching over to 300 mm wafer processing can no longer rely on slow, inconsistent manual inspection. The WaferView tool provides a superior automated solution for high-throughput macrodefect inspection with its unique combination of a full-color vision system; an on-board ReviewScope™ microscope, which eliminates the need for a separate review tool; robust, automatic defect classification software; and backside inspection capability."
Rudolph's WaferView 320 uses the company's patented Automatic Defect Classification (ADC) technology to accurately and consistently classify macrodefects. Unlike competing tools that provide only a limited number of predefined or customer-defined defect types, the WaferView's adaptive Knowledge-Base™ system has the versatility to quickly and easily define the new defect types that will accompany advanced lithography, CMP, and etch processes. This ability further allows manufacturers to define defects based on their existing classification codes, which can vary widely from manufacturer to manufacturer. These capabilities enable faster development and ramp of new processes, more reliable rework decision-making, improved root-cause analyses, and more consistent statistical process control (SPC) data that can significantly enhance process yields.
The WaferView 320 incorporates the second-generation of Rudolph's full-color vision system that has been fab-proven to detect more yield-robbing defects than competing gray-scale tools. The integrated on-board high-resolution ReviewScope provides rapid review and dispositioning of defects as well as automated sub-micron defect detection capabilities. Additional features on the
WaferView 320 include user-friendly operation, fast and automatic recipe creation, and the InstaMatch™ method for superior tool-to-tool matching.
The WaferView 320 is a member of the WaferView Team™, which also includes the integrated i-MOD™, the WaferView 325™, the WaferView 320 Turbo™, and the YieldView® products. Rudolph's Team is the first to offer cost-effective real-time 100% inspection of the entire surface of every wafer at process throughputs for each critical lithography, CMP, and etch process step.
The WaferView 320 tools will ship in the fourth quarter of 2004 and the first quarter of 2005.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology and defect inspection systems used by semiconductor device manufacturers. The Company's products provide a full-fab solution through its families of proprietary systems, which are used throughout the device manufacturing process. Rudolph's product development has successfully anticipated and addressed many emerging trends that are driving the semiconductor industry's growth in order to enhance the competitiveness of its products in the marketplace. The Company's success in creating complementary metrology and inspection applications through aggressive research and development is key to Rudolph's strategy for continued technological and market leadership.
Safe Harbor Statement
This press release contains forward-looking statements. Actual results may differ materially from those projected due to a number of risks, including, but not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph Technologies' business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph Technologies cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties summarized under the heading "Factors that May Affect Future Results" in Rudolph Technologies' Form 10-K filed for the year ended December 31, 2003. These factors are updated from time to time through the filing of reports and registration statements with the Securities and Exchange Commission. Rudolph Technologies does not assume any obligation to update the forward-looking information contained in this press release.