Top-ten U.S. Manufacturer Embraces All-surface Inspection Methodology Across Multiple Front-end Processes and Incoming Tool Qualification
Flanders, NJ (March 29, 2006) -- Rudolph Technologies (NASDAQ: RTEC), a leading provider of process control equipment for thin film measurement and macro defect inspection, today announced receipt of a multiple-system order from a top-ten U.S. semiconductor manufacturer for its all-surface, advanced macro defect detection system. Each all-surface system consists of a frontside inspection module, a backside inspection module and the new E25™ Wafer Edge Inspection System module. This integrated design allows the customer to automatically detect, classify and correlate macro defects from the front, back and edge of semiconductor wafers for deposition, lithography, etch and CMP applications.
The value of automated front-surface macro defect inspection is well established for advanced manufacturing processes. All-surface inspection now addresses the additional and disproportionately high number of killer defects that are known to originate in the edge and backside regions of the wafer. "Inspecting the edge and backside regions offers new opportunities for existing fabs to dramatically increase yield on their established processes," said Ardy Johnson, Rudolph's vice president of marketing. "Manufacturers are now learning that as much as 30 percent of killer defects come from these areas. For instance, films can wrap around the edge and accumulate in layers that eventually flake off, only to be re-deposited on the frontside of the wafer."
Defect detection is just the beginning; the objective is to correlate data from all surfaces to extract significant, actionable information. For example, a particle on the backside may be harmless in itself, but when it causes a lithography defocus defect on the frontside, it becomes critical. Rudolph's all-surface inspection systems use advanced optics to provide an accurate location, sizing and color imaging of the defects, allowing a quicker path toward root-cause identification.
Rudolph attributes the rapid acceptance of its all-surface technology to applications that have been developed in collaboration with its customers. In the case of this multiple-system order, process engineers were aware of blister-like defects in the lower edge bevel region, but had no economically feasible means to quantify those defects and evaluate the effects of corrective actions. "They knew where the problems were coming from but available techniques, like SEM inspection, could not see the lower edge bevel region," said Johnson. "Working together, we were able to adapt our E25™ System to provide the fast, accurate, and statistically significant results they needed to evaluate their process alternatives."
In addition to improving yield, the aforementioned customer is using Rudolph's all-surface inspection solutions to qualify incoming tools for their newest fab.
About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. Rudolph has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act"). In some cases, you can identify those so-called "forward-looking statements" by words such as "may," "will," "would," "should," "expects," "plans," "anticipates," "believes," "feels," "estimates," "predicts," "potential," or "continue," or the negative of those words and other comparable words. Rudolph wishes to take advantage of the "safe harbor" provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph's control. Factors that could cause actual results to differ materially from the expectations expressed in such forward-looking statements, include, but are not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph's business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties as summarized in Rudolph's Form 10-K report for the year ended December 31, 2005 and other filings with the Securities and Exchange Commission ("SEC"), which are available at http://www.sec.gov, the SEC's website, and at Rudolph's website, which is http://www.rudolphtech.com. While these factors may be updated from time to time through the filing of reports and registration statements with the SEC, Rudolph does not assume any obligation to update the forward-looking information contained in this press release.
For more information, please contact:
Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com