Rudolph's depth of application knowledge and breadth of inspection solutions continues to advance market share leadership

San Francisco, CA (July 11, 2006) -- Rudolph Technologies, Inc. (NASDAQ: RTEC), the market leader in macro defect inspection, today announced a repeat order for multiple NSX® 115 Macro Defect Inspection systems for installation at two fabs owned by a large European semiconductor manufacturer. The multiple-unit sale initiates a program to standardize inspection equipment across the fab for a wide range of products and manufacturing technologies.

"A major challenge was providing a tool that would fit with this customer's broad range of products and applications, and to do so in a cost effective manner, " said Rajiv Roy, marketing director at Rudolph. "For example, in one process they work with ultra-thin wafers less than one hundred micrometers thick. The installed base with probe mark inspection and our applications experience in handling a broad variety of bond-pad types played a key role in the selection process."

The Rudolph tools will be used to monitor critical final manufacturing processes such as probe mark inspection, post-saw inspection, and outgoing quality control (OQA) on a wide variety of products including high-performance automotive devices fabricated on silicon and silicon carbide wafers. "We participated in a fairly lengthy evaluation," Roy continued. "The criteria included accommodating literally over a thousand different product types as well as the flexibility to address inspection needs at different process points. At the end, we were able to offer the highest performance, greatest flexibility, and lowest cost of ownership for the customer's complex mix of products."

Rudolph's NSX Inspection system is a high-throughput macro defect inspection solution that is able to detect defects as small as 0.5 micrometers. It is used primarily for applications in back-end semiconductor manufacturing processes, such as probing, bumping, dicing, and general handling, which can have a major impact on OQA and yield. The NSX quickly and accurately detects yield-inhibiting defects, providing quality assurance and valuable process information. In combination with Rudolph's edge inspection and backside inspection systems, the NSX can detect and correlate defects on all surfaces of a wafer.

About Rudolph Technologies, Inc.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.

Safe Harbor Statement
The press releases in this July 11, 2006 Press Kit contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act"). In some cases, you can identify those so-called "forward-looking statements" by words such as "may," "will," "would," "should," "expects," "plans," "anticipates," "believes," "feels," "estimates," "predicts," "potential," or "continue," or the negative of those words and other comparable words. Rudolph wishes to take advantage of the "safe harbor" provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph's control. Factors that could cause actual results to differ materially from the expectations expressed in such forward-looking statements, include, but are not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph's business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties as summarized in Rudolph's Form 10-K report for the year ended December 31, 2005 and other filings with the Securities and Exchange Commission ("SEC"), which are available at http://www.sec.gov, the SEC's website, and at http://www.rudolphtech.com, the Rudolph website. While these factors may be updated from time to time through the filing of reports and registration statements with the SEC, Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

For more information, please contact:

Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com

Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com