Macro Inspection System Offers Fast, Reliable, Cost-effective Inspection in Price-sensitive Applications

FLANDERS, NJ (June 12, 2007) -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process control metrology, defect inspection and data analysis software for the semiconductor manufacturing industry, today announced the first shipment of its new NSX® 100 Automated Macro Defect Inspection System. This newest member of Rudolph's NSX family of back-end inspection tools is designed to provide fast, reliable inspection at minimal cost for price-sensitive applications. The NSX 100 System succeeds the widely-used NSX 90 and NSX 95 Systems, which together have an installed base of more than 200 units.

"We are very pleased with the customer feedback on this new tool," said Ardy Johnson, Rudolph's marketing vice president. "Although this is a long-term customer with multiple NSX 95 Systems installed, our introduction of the NSX 100 as a replacement triggered a thorough competitive evaluation. Their decision confirms for us the value of the improvements we designed into the new model. It also testifies to the quality of their experience with the NSX predecessors, as well as our application and service support."

The NSX Series is a thoroughly-proven, automated macro defect inspection solution designed for the back-end manufacturing environment as well as front-end quality assurance applications. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on process yield and product quality. The NSX family of inspection tools quickly and accurately detects these yield-robbing defects, providing both quality assurance and valuable feedback on process performance. Transferred to yield management programs, such as Rudolph's Discover™ software package, this information allows manufacturers to reduce their manufacturing costs and bring new products to market sooner.

The NSX 100 handles wafers up to 200 mm (automotive is predominantly 200 mm) at throughputs as high as 88 wph. It was designed to provide cost-effective inspection capability in price-sensitive applications. Its particular balance of throughput and resolution is well suited to processes such as gold bump inspection, where higher resolution provides little or no benefit and higher throughput lowers overall cost of ownership. The system features an easy-to-use Windows®-based user interface.

Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act"). In some cases, you can identify those so-called "forward-looking statements" by words such as "may," "will," "would," "should," "expects," "plans," "anticipates," "believes," "feels," "estimates," "predicts," "potential," or "continue," or the negative of those words and other comparable words. Rudolph wishes to take advantage of the "safe harbor" provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph's control. Factors that could cause actual results to differ materially from the expectations expressed in such forward-looking statements, include, but are not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph's business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties as summarized in Rudolph's Form 10-K report for the year ended December 31, 2006 and other filings with the Securities and Exchange Commission ("SEC"), which are available at http://www.sec.gov, the SEC's website, and at http://www.rudolphtech.com, the Rudolph website. While these factors may be updated from time to time through the filing of reports and registration statements with the SEC, Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

For more information, please contact:

Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com

Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com