Simultaneous advanced film characterization mode is first on market, delivering higher throughput and enhanced measurement capability
Flanders, New Jersey (July 13, 2009) -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the availability of its new S3000S™ Metrology System for in-line process control of advanced diffusion and fab-wide thin film applications. The innovative optical design of the S3000S System enables simultaneous measurement with multi-wavelength, multi-angle Focus Beam Ellipsometry (FBE) and deep ultraviolet reflectometry (DUVR)─reducing measurement time and significantly increasing throughput over previous generations. Rudolph is accepting orders now with first shipments planned for the end of this quarter.
"Our customers continue to look for ways to lower costs and improve fab productivity. The S3000S System helps them achieve this by combining higher throughput with the industry-leading stability needed for thinner films and tighter process tolerances at the 45nm and 32nm nodes," said Jack Kurdock, Rudolph's vice president and general manager of the Metrology Business Unit. "The ability to measure simultaneously with focused beam ellipsometry and deep UV reflectometry, introduced with the S3000S, allows IC manufacturers to take advantage of a pool of multi-wavelength, multi-angle ellipsometer and multi-wavelength reflectance data for accurate, repeatable characterization of complex films and precise control of advanced processes without sacrificing throughput."
Rudolph's patented FBE technology uses high-intensity, long-life laser light sources to provide superior stability. A small beam size enables measurements in small test sites. Laser light sources have the inherent wavelength accuracy needed to meet increasingly tighter tool-to-tool matching requirements simply and robustly. The optional MAControl™ module provides one-step, uniform, non-destructive removal of the molecular airborne contamination layer on thin films to allow more accurate measurement of the true thin film thickness. The new S3000S System is built on the reliable, field-proven Vanguard-II automation platform that is shared by all Rudolph metrology products.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the "Act") which include the benefit to customers of Rudolph's products and customer service, Rudolph's ability to deliver products and services consistent with our customers' demands and expectations, as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the "safe harbor" provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph's control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons and that the offered design enhancements may not necessarily translate into significant revenue. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph's Form 10-K report for the year ended December 31, 2008 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph's current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.
Contacts:
Investors
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com