Lithography provides the patterning that is the building block for structures throughout the device. Films on wafers are coated with resist and then exposed with light, causing the resist to harden. A reticle is used to determine which specific regions of die will be exposed. The wafer is then developed to remove any area of resist that was not exposed, thereby setting the pattern for the layer of the die. If the pattern is flawed, the resist can be removed and the lithography process can be reworked. Wafers are inspected for numerous defect types to determine if rework is required. The size of typical lithography defect types has been shrinking in correlation with smaller line widths.