Advanced Packaging, January 2008

"Surely the most significant trend in semiconductor packaging is the tremendous growth in multiple chip packaging, including everything from wire-bonded stacked die to 3D ICs with through silicon vias (TSVs). This growth is driven by demands for smaller form factors, higher performance and multiple functions across applications ranging from handheld devices and mobile electronics to high speed computers. New and emerging processes bring new requirements for measurement and control: bond pad inspection, wafer thinning and bonding, deep silicon etching, and more. Our challenge at Rudolph is to anticipate these needs and provide cost-effective, production-worthy solutions."

-Rajiv Roy, Rudolph Technologies, Inc.

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