Test & Measurement World - May 2008

"Nathan Little, executive VP for Rudolph Technologies, contends that examining the marks left by wafer-probe cards reveals much about the quality of the test. "Traditionally, we looked at individual probe marks on the wafer for a go/no-go decision," he said. "The marks may have occurred in the functional area of the die, for example, or they may be positioned too close to the edge. You can correlate those marks to infer the 'goodness' of the prober and the probe card. A good probe card ensures a more accurate test and minimizes the chance of damage to the die.""

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