Advanced Packaging, August 2008

"Emerging micro-bump wafers present unique challenges for measurement and inspection. At the most fundamental level, any viable technology must have the resolution and sensitivity required to measure critical dimensions of micro-bumps. Die with 25-µm (1 mil) bumps on a 50-µm (2 mils) pitch are in development, and smaller bumps with finer pitches are on the way. Additionally, with bump counts rising above 10,000 per die, wafer inspection systems must deal with an increasing number of bumps at both the die and wafer levels. Analysis software and computational hardware must have sufficient capacity to store and process location and dimensional data for millions of bumps per wafer."

- Reza Asgari, Rudolph Technologies, Inc.

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