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Abstract

Young's modulus, which is a measure of elastic strength, provides a good predictor of an interlevel dielectric (ILD) film's ability to withstand chemical mechanical polishing (CMP) and packaging stresses. Picosecond ultrasonics offers a high-throughput, non contact method to measure Young's modulus that is compatible with inline process monitoring. Discussion of this technique and its capability to measure on PECVD non porogen porous MSQ films with good correlation with nanoindentation and ellipsometric porosimetry (EP) measurements will be presented.