Advanced macro defect inspection, the inspection of defects 0.5 µm and greater, is critical to wafer manufacturers that recognize the value of defect inspection and metrology to monitor their processes, provide process enhancing information and ultimately lower manufacturing costs and time to market.

Advanced macro defect inspection fills the gap between traditional micro (0.5 micron and smaller) and traditional macro (50 micron and greater) inspections and offers a value, performance and flexibility to deploy 100% inspection throughout the fab, including key process steps such as lithography, etch, CMP and final quality control (QC).

Typical defects include:

• Pattern defects
• Incomplete Etch
• Resist defects
• Scratches
• Large scale contamination
• Others